Description

Placement Performance Specifications

1. Theoretical Throughput:
   • 22,000 CPH (dual cantilever configuration, 8 placement spindles in concurrent operation). Actual throughput may vary based on component mix and program optimization.
2. Positional Accuracy:
   • Standard components: ±40μm (Cpk≥1.0)
   • IC components: ±30μm (Cpk≥1.0)
3. Component Handling Range:
   • Supports 0402 metric (0.4×0.2mm) to 30×30mm components, with maximum component height of 12mm.

Modular System Architecture

1. Scalable Feeding Platform:
   • 60-slot 8mm tape feeder capacity (expandable to tube/tray components), optimized for medium-low density PCB assembly.
2. Multi-Nozzle Placement Head:
   • Standard 4-nozzle configuration (1.0–4.0mm nozzle diameters) with automatic tool switching for mixed-component applications.

Vision & Alignment System

1. 2D Fiducial Recognition:
   • Base vision system with 2D camera for PCB fiducial mark alignment and component centering, suitable for conventional components. 3D laser inspection module available as optional upgrade.
2. In-Flight Component Recognition:
   • On-the-move vision verification during placement head traversal reduces idle time and enhances throughput.

Motion Control Technology

1. Servo-Driven Mechanical System:
   • X/Y axes utilize lead screw drives (lower maintenance cost vs. linear motors) with positional stability optimized for mid-volume production.
2. Vibration Mitigation:
   • Software-based acceleration profiling reduces high-speed motion-induced mechanical resonance, ideal for 中小型 (mid-sized) PCB assembly.

Software Ecosystem

1. Placement Programming:
   • Manual placement sequence optimization; lacks real-time dynamic path adjustment. Typical changeover time: ~30 minutes.
2. Integrated Fault Diagnostics:
   • Predefined error code library (e.g., nozzle clogging, feeder jamming) for rapid troubleshooting and maintenance.

Key Terminology Upgrades:

• Throughput: Specified “concurrent operation” for spindle coordination.
• Accuracy: Standardized “positional accuracy” terminology.
• Feeding: “Slots” instead of “stations” for feeder capacity; “mixed-component applications” for versatility.
• Vision: “Fiducial mark alignment” replaces “Mark point recognition”; “in-flight verification” for dynamic inspection.
• Motion Control: “Lead screw drives” clarified; “resonance” instead of “jitter” for mechanical precision.
• Software: “Changeover time” industry standard; “fault diagnostics” over “fault diagnosis system”.