Description

Conveying System

1. Substrate Handling Range:
   • Standard: 50×50mm–510×460mm PCBs; optional expansion to 1,200×460mm for ultra-long substrates.
2. Magnetic Levitation Track Technology:
   • Ensures high-stability PCB transport during high-speed placement operations.

Vision System

1. Fiducial Mark Camera System:
   • Combines in-flight vision (Fly Camera) and fixed-position vision (Fix Camera) for real-time coordinate correction via fiducial mark recognition.
2. Component Centering Vision Module:
   • High-precision alignment of 03015 metric (0.3×0.15mm) micro-components, verifying position and polarity.
3. Optional 3D Laser Profiling:
   • Post-pick inspection of component height and coplanarity to prevent cold solder defects.

Placement Head System

1. Dual Gantry Architecture:
   • 10 independent spindles per gantry enable synchronized pick-and-place operations for enhanced throughput.
2. Adaptive Pressure Control:
   • Dynamically adjusts placement force for components up to 15mm in height, with programmable pressure settings.
3. Automatic Nozzle Changer:
   • Supports 7 standard nozzles + 9 optional nozzles for quick tooling adaptation.

Feeder System

1. Powered Feeder Platform (eFeeder):
   – 兼容 8–56mm tape feeders, tube/tray components, with 120-station capacity.
2. Smart Feeder Technology:
   • Enables automatic material splicing and real-time shortage alerts for continuous production.

Motion Control System

1. Linear Motor Drives:
   • X/Y axes with 2μm resolution achieve ±25μm positional accuracy for IC components.
2. Vibration Dampening Technology:
   • Maintains stability during ultra-high-speed placement (up to 92,000 CPH).

Software Ecosystem

1. Dynamic Placement Path Optimization:
   • Real-time sequence optimization reduces gantry idle travel, integrated with SMEMA/SECS/GEM protocols for MES/ERP connectivity.
2. Auto-Calibration & Thermal Compensation:
   • Automated system recalibration and temperature drift correction ensure consistent accuracy.