Description

Conveyor System

1. Substrate Handling Capability:
   • Supports standard PCB sizes from 50×50mm to 510×460mm, compatible with flexible and rigid board transport.
   • Base dual-track design with servo-motor-driven conveyance ensures stability, featuring the cost-optimized omission of advanced magnetic levitation technology.

Vision System

1. Fiducial Alignment Module:
   • Basic PCB positioning via 2D camera with fiducial mark recognition, achieving ±28μm positional accuracy (in contrast to DECAN S2’s ±25μm).
2. Component Centering Vision:
   • Supports 0402 metric (0.4×0.2mm) and larger components; 3D laser inspection module available as optional upgrade (not standard).

Placement Head

1. Single Cantilever Architecture:
   • 6 independent spindles deliver a theoretical throughput of 47,000 CPH (vs. S2’s 92,000 CPH), suited for medium-throughput production.
2. Adaptive Force Control:
   • Programmable placement pressure adjustment for conventional components (e.g., resistors, capacitors) and small ICs (e.g., QFP packages).

Feeder System

1. Powered Feeder Platform (eFeeder):
   • Supports 8–44mm tape feeders and tube components with 80-station capacity (vs. S2’s 120 stations).
2. Basic Material Management:
   • LED-based tape residue alerts; lacks integrated automatic material splicing functionality.

Motion Control System

1. Servo-Driven Mechanics:
   • X/Y axes utilize traditional lead screw drives with ±30μm positioning accuracy (vs. linear motor’s ±25μm).
2. Software-Based Vibration Mitigation:
   • Acceleration profile optimization maintains stability, though high-speed operation may require throughput reduction for consistency.

Software & Operational Interface

1. Manual Path Optimization:
   • Supports manual component grouping and placement sequence adjustment; lacks real-time dynamic optimization algorithms.
2. Basic Fault Diagnostics:
   • Predefined error code library (e.g., nozzle clogging, feeder jams) without integrated remote monitoring capabilities.