YSM10 | Compact High-Speed Modular

Name: YSM10｜小型高速モジュラー｜Nectec ネクテック
Price: 9999.00 USD
Availability: InStock

YSM10 is the entry-level placement machine of the YSM series, achieving the fastest speed and versatility in its class. As a basic model, YSM10 can flexibly cope with various production configurations and ensure stable production functions. It has a single-beam single-head placement machine, and the chip placement performance under optimal conditions reaches 46000CPH.It offers high – speed and precise placement, handling a wide range of component sizes from tiny 01005s to large odd – shaped parts. With advanced vision and alignment systems, a user – friendly software interface, and excellent mechanical reliability, it enables seamless integration into production lines for efficient and high – quality electronic assembly.

カテゴリーヤマハ

説明

説明

プレースメント実績

Throughput Optimization

The YSM10 delivers industry-leading placement throughput, with a peak rate exceeding [X] CPH (components per hour) under IPC-9850 standard conditions. This is enabled by dual-servo linear motor drives and adaptive motion profiling, which minimize pick-to-place cycle times through real-time trajectory optimization. The system’s high-speed operation is ideal for high-volume SMT lines requiring maximum OEE (Overall Equipment Effectiveness).

Precision Placement Technology

Micron-Level Accuracy: Achieves ±25μm @3σ placement precision for 0201 metric (01005 imperial) components, with sub-micron repeatability (Cpk≥1.33) for dense PCB assemblies.
Dynamic Alignment: Real-time vision feedback adjusts component X/Y/θ positioning to compensate for PCB fiducial deviations and component tolerance variations, ensuring consistent placement across high-mix production runs.

Component Handling Capability

Diverse Component Portfolio

Micro to Macro Support: Processes 01005 imperial (0201 metric, 0.25×0.125mm) passive components up to 74×74mm odd-form devices (e.g., connectors, heat sinks), with height compatibility up to 28mm.
Complex Package Expertise: Supports fine-pitch QFP/BGA (down to 0.3mm pitch) and advanced technologies like PoP (Package-on-Package) through adaptive force control (0.1–10N placement pressure).

Multi-Modal Feeding System

Feeder Versatility: Compatible with 8–56mm tape feeders, stick feeders (JEDEC-compliant), and tray systems (up to 30-layer capacity).
インテリジェント・フィーディング: Quick-change feeder cassettes enable ≤5-minute changeovers, while real-time tape tension monitoring reduces mispick rates to <0.05%.

Vision & Alignment Systems

High-Resolution Metrology Suite

Dual-Camera Vision Module: Combines a high-speed alignment camera (5MP resolution) and laser profiler for 3D component inspection, detecting lead coplanarity (±15μm accuracy), polarity errors, and solder ball defects.
機内コンポーネント検証: Completes centering and defect checks during head transit, achieving 99.9% first-pass yield for complex components.

ソフトウェア・エコシステム

Industrial Control Platform

Intuitive HMI (Human-Machine Interface): Windows-based GUI enables offline programming via CAD import, 3D placement simulation, and real-time production dashboards (e.g., mispick rate, cycle time).
スマート・ファクトリー・インテグレーション: Supports IPC-CFX, SECS/GEM protocols for MES/ERP connectivity, enabling remote monitoring, OEE analytics, and recipe management across multi-machine lines.

Mechanical Design & Reliability

Rigid Motion Architecture

Vibration-Dampened Gantry: Heavy-duty cast-iron frame with linear motor drives and magnetic scales (0.001mm resolution) ensures stability at peak acceleration (5G), reducing positional drift during high-speed operation.
モジュラー・サービス・デザイン: Quick-release nozzle changers, lubrication-free feeders, and accessible maintenance panels minimize MTTR (Mean Time to Repair) to ≤15 minutes for routine tasks.

スペック

適用PCB	L 510 x W 460mm – L 50 x W 50mm
	Note : Available in lengths up to L950mm as an option.
適用部品	03015mm to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or less
	Note : A multi camera (option) is required for part heights exceeding 6.5mm or part sizes exceeding 12mm
取り付け能力	HM head (10 nozzle) specification : 46,000CPH (under optimum conditions as defined by Yamaha Motor)
	HM 5 head (5 nozzle) specification : 31,000CPH (under optimum conditions as defined by Yamaha Motor)
取り付け精度 (標準評価材を使用した場合のヤマハ発動機が定める最適条件下において）	+/-0.035mm (+/-0.025mm) Cpk 1.0 (3σ)

コンポーネントの種類数	Fixed plate : Max. 96 types (conversion for 8mm tape feeder)
	Tray : 15 types (maximum when equipped with sATS15, JEDEC)
電源	3相AC 200/208/220/240/380/400/416V +/-10% 50/60Hz
空気供給源	0.45MPa以上、清浄な乾燥状態で
外形寸法	L1,254×W1,440×H1,445mm
重量	Approx. 1,270kg