Description

1. Hybrid placement system
• Dual process integration: SIPLACE CA2 is the first hybrid device that combines SMT placement with semiconductor chip bonding. It can process SMD components from tape (such as resistors, capacitors) and bare chips directly from cut wafers (such as flip chips) in the same process without the need for additional equipment.
◦ Placement speed: supports placement of 50,000 chips (bonding process) or 76,000 SMD components (tape placement) per hour, with an accuracy of 10 μm @ 3σ, suitable for high-density advanced packaging (such as SiP system-level packaging).
• Parallel processing technology: Through the buffer storage module, 16 new chips are pre-fetched while the placement head is working, realizing parallel processing of wafer fetching and placement operations, significantly improving efficiency. For example, the flip chip processing speed can reach 40,000 pieces/hour.

2. Wafer handling and feeding system
• Wafer replacement system: supports fast switching of 50 different wafers, with a replacement time of only 6.5 seconds, significantly reducing downtime. Direct wafer feeding eliminates the taping step, saves taping material costs (up to 800 kilometers of waste tape per year), and improves sustainability.
• Feeding compatibility: compatible with 8mm to 56mm electric feeders, supports tube-mounted, tray-mounted components, and JEDEC standard trays.
Optional wafer system or roll-to-roll trolley (COT) to flexibly adapt to different production needs.

3. Vision and inspection system
• High-precision recognition technology:
◦ Laser recognition: covers real-time detection of special-shaped components from 0402 (01005 imperial) to 50mm×150mm to ensure placement accuracy.
◦ Image recognition (VCS camera): supports 3-color lighting technology, enhances the recognition ability of fine structures (such as BGA solder balls), and has an accuracy of ±30μm.
• Tracking capability: provides bare chip-level tracking function, records the full process data of each chip from the wafer position to the PCB mounting position, and meets the high traceability requirements of automotive electronics.

4. Motion control and automation
• High-speed linear drive system: The X/Y axis uses high-precision linear motors and magnetic suspension technology, combined with a 0.001mm resolution magnetic scale to achieve high-speed (acceleration optimization) and high-stability mounting.
◦ Dual servo Y-axis drive: optimizes track transmission, reduces vibration, and improves the accuracy of long substrate mounting.

5. Software and open interface
• Intelligent software suite: JaNets production management system: supports offline programming (CAD import), path optimization and simulation debugging, and shortens line change time.
WORKS workshop management suite: provides functions such as material loading verification and logistics optimization to improve overall production efficiency.
• Open communication interface: supports IPC-CFX and SECS/GEM standard interfaces, achieving seamless integration with MES/ERP systems and meeting the data communication needs of smart factories.