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AIMEX III | Flexible placement machine

The FUJI AIMEX III placement machine is designed for high-mix production and achieves efficient production with the collaboration of multiple components. Its core components have diverse functions and each system works closely together, greatly improving the flexibility, precision and efficiency of production.

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AIMEX III | Flexible placement machine

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Description

1. Placement Head System

Multi-Configuration Placement Heads

Equipped with H24S, DX, V12, H08M(Q), H02F, H01, and OF placement heads to address diverse component sizes/types.

 

  • H24S Head: Places 03015 metric components with ±25μm accuracy; dual H24S heads achieve 80,000 CPH in throughput-optimized mode.
  • DX Multifunction Head: Dynamically switches between 12-nozzle, 4-nozzle, and single-tool configurations for 0402–102×102mm components (chips, large-form, odd-shaped), with optional dispense tool integration for in-module dispensing-placement workflows.
  • Specialized Placement Modes: Supports press-fit insertion for large connectors and force-controlled clamping placements to meet niche production requirements.

2. Feeder System

High-Capacity Material Handling

  • 130-Station Material Platform (8mm tape equivalent): Reduces changeover frequency by accommodating diverse component types, ideal for mixed-production environments.
  • Multi-Feeding Compatibility: Supports tape, tube, and tray feeding units with hybrid placement capabilities for mixed-format components.
  • Rapid Changeover Technology:
    • Multi Feeder Unit (MFU) enables batch feeder replacement to minimize downtime.
    • Optional offline-powered MFU allows one-button feeder function release for efficient external changeovers.

3. PCB Handling System

Versatile Substrate Management

  • Single Conveyor: Processes 48×48–774×710mm PCBs.
  • Dual Conveyor:
    • Dual-track: Handles 48×48–774×330mm PCBs for parallel production of two distinct products.
    • Single-track: Supports up to 774×610mm; optional upgrades for ultra-long substrates (e.g., LED panels).
  • Dual-Track Parallel Operation: Enables concurrent production on one track during changeovers on the other, maximizing OEE.

4. Inspection System

Multi-Stage Quality Control

  • Component Verification via IPS:
    • Post-pick detection of component standoff, height, pick confirmation, and reverse placement.
    • Pre-placement LCR testing for passive components (inductors, capacitors, resistors) to reject electrical non-conformances.
  • 3D Coplanarity Scanning: Detects BGA/CSP solder ball defects (e.g., missing/reduced height) to prevent faulty components from entering the process.
  • Pre-Placement Board Inspection: Laser sensor measures PCB warpage, rejecting boards outside tolerance (e.g., ±0.5mm) to ensure placement validity.

5. Motion Control System

High-Efficiency Mechanics

  • Energy-Optimized Drives: Utilizes high-efficiency motors to reduce power consumption while maintaining precision placement performance.
  • Precision Assurance:
    • Dynamically calibrated motion controls ensure accurate component picking/placement across varying accuracy requirements (e.g., ±25μm for micro-components).
    • Advanced servo algorithms minimize vibration and enhance repeatability for fine-pitch applications.

specification


M3 III

M6 III

Applicable PCB size (LxW)

48 x 48 mm to 305 x 610 mm (single conveyor)

48 x 48 mm to 610 x 610 mm (single conveyor)

48 x 48 mm to 305 x 510 mm (double conveyor/single)

48 x 48 mm to 610 x 510 mm (double conveyor/single)

48 x 48 mm to 305 x 280 mm (double conveyor/dual)

48 x 48 mm to 610 x 280 mm (double conveyor/dual)

Part types

Up to 20 types of parts (calculated using 8 mm tape)

Up to 45 types of parts (calculated using 8 mm tape)

PCB loading time

For double conveyor: 0 sec (continuous operation)

For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules)

Placement accuracy

H24G

: +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00

H24G

: +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00

(Fiducial mark standard)

V12/H12HS

: +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00

V12/H12HS

: +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00

The placing accuracy is obtained from tests conducted by Fuji.

H04S/H04SF

: +/-0.040 mm (3sigma) cpk≥1.00

H08M/H04S/H04SF

: +/-0.040 mm (3sigma) cpk≥1.00

H08/H04

: +/-0.050 mm (3sigma) cpk≥1.00

H08/H04/OF

: +/-0.050 mm (3sigma) cpk≥1.00

H02/H01/G04

: +/-0.030 mm (3sigma) cpk≥1.00

H02/H01/G04

: +/-0.030 mm (3sigma) cpk≥1.00

H02F/G04F

: +/-0.025 mm (3sigma) cpk≥1.00

H02F/G04F

: +/-0.025 mm (3sigma) cpk≥1.00

GL

: +/-0.100 mm (3sigma) cpk≥1.00

GL

: +/-0.100 mm (3sigma) cpk≥1.00

Productivity

H24G

: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)

H24G

: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)

The throughput above is based on tests conducted at Fuji.

V12

: 26,000 cph

V12

: 26,000 cph

H12HS

: 24,500 cph

H12HS

: 24,500 cph

H08

: 11,500 cph

H08M

: 13,000 cph

H04

: 6,500 cph

H08

: 11,500 cph

H04S

: 9,500 cph

H04

: 6,500 cph

H04SF

: 10,500 cph

H04S

: 9,500 cph

H02

: 5,500 cph

H04SF

: 10,500 cph

H02F

: 6,700 cph

H02

: 5,500 cph

H01

: 4,200 cph

H02F

: 6,700 cph

G04

: 7,500 cph

H01

: 4,200 cph

G04F

: 7,500 cph

G04

: 7,500 cph

GL

: 16,363 dph (0.22 sec/dot)

G04F

: 7,500 cph

0F

: 3,000 cph

GL

: 16,363 dph (0.22 sec/dot)

Supported parts

H24G

: 0201 to 5 x 5 mm

Height

: up to 2.0 mm

V12/H12HS

: 0402 to 7.5 x 7.5 mm

Height

: up to 3.0 mm

H08M

: 0603 to 45 x 45 mm

Height

: up to 13.0 mm

H08

: 0402 to 12 x 12 mm

Height

: up to 6.5 mm

H04

: 1608 to 38 x 38 mm

Height

: up to 9.5 mm

H04S/H04SF

: 1608 to 38 x 38 mm

Height

: up to 6.5 mm

H02/H02F/H01/0F

: 1608 to 74 x 74 mm (32 x 180 mm)

Height

: up to 25.4 mm

G04/G04F

:0402 to 15 x 15 mm

Height

: up to 6.5 mm

Module width

320 mm

645 mm

Machine dimensions

L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III)

W: 1900.2 mm, H: 1476 mm

DynaHead(DX)

Nozzle quantity

12

4

1

Throughput(cph)

25,000

Parts presence function ON: 24,000

11,000

4,700

Part size

(mm)

0402 (01005″) to 7.5 x 7.5

Height:

Up to 3.0 mm

1608 (0603″)

to 15 x 15

Height:

Up to 6.5 mm

1608 (0603″)

to 74 x 74 (32 x 100)

Height:

Up to 25.4 mm

Placing accuracy

(Fiducial mark based referencing)

+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00*

+/-0.040 mm (3σ) cpk≥1.00

+/-0.030 mm (3σ) cpk≥1.00

+/-0.038 mm obtained with rectangular chip placement (high

accuracy tuning) under optimal conditions at Fuji.

Part presence

check

o

x

o

Parts

supply

Tape

o

o

o

Stick

x

o

o

Tray

x

o

o

Parts supply system

lntelligent feeders

Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape

Stick feeders

4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm)

Trays

Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M)，276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC)

Options

Tray feeders, PCU II (Pallet Change Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Nexim Software

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