説明

1. Excellent Thermal Stability
   Designed with strict production process control to ensure consistent performance during reflow soldering, maintaining stability across varying temperature profiles (e.g., 217–227°C for Sn-Ag-Cu alloys and 138°C for Sn-Bi alloys). This feature enables reliable soldering in high-precision electronic assembly.
2. Superior Solderability and Wetting Property
   Formulated to provide optimal adhesion to base metals, ensuring full and uniform solder joints. The low surface tension facilitates excellent wetting, minimizing solder defects and enhancing joint strength.
3. Wide Reflow Window
   Accommodates diverse soldering processes with a broad operational temperature range, making it suitable for complex PCB assemblies and fine-pitch components (e.g., 0201, 01005, and fine-pitch IC devices).
4. Minimal Solder Beads and Voids
   Engineered to reduce short circuits caused by solder beads and ensure high-strength joints with low void rates, meeting strict reliability standards for electronic products.
5. 多様な用途のための多様な合金組成
   Offers multiple alloys (e.g., Sn96.5Ag3.0Cu0.5, Sn42Bi58) to cater to different requirements: high-temperature resistance for automotive electronics, low-temperature soldering for heat-sensitive components, and lead-free compliance for environmental standards.
6. Fine Powder Grades for Precision Printing
   Available in powder diameters ranging from Type 3 to Type 7, supporting precise deposition via printing or dot coating for applications such as flexible PCBs, wireless chargers, and optoelectronic devices.