说明

1. Low-Melting Point Alloy Composition
   Formulated with lead-based alloys such as Sn63Pb37 and Sn62.9Pb36.9Ag0.2, offering a melting point of 183°C (for Sn63Pb37) and 178–190°C for Ag-containing alloys. This enables efficient soldering at lower temperatures, reducing thermal stress on components and PCBs.
2. Versatile Process Adaptability
   Suitable for printing, dot coating, and through-hole printing processes, compatible with reflow soldering techniques. Its RMA (Rosin Mild Activated) type flux ensures balanced activity for reliable wetting without excessive residue.
3. Broad Industry Application
   Designed to meet assembly requirements for household appliances, automotive electronics, military equipment, and LED products. The fine powder diameters (Type 3–4) support precision deposition on various component sizes.
4. Reliable Solder Joint Performance
   Delivers bright, full solder joints with excellent oxidation resistance, thanks to the pure tin composition and sufficient antioxidant additives. The flux distribution ensures minimal spatter and smoke during soldering.