说明

Mounting Head System

Multi-Nozzle Placement Architecture

• Dual Head Configurations: Offers 6-nozzle and 3-nozzle mounting heads for quick changeover, supporting mixed placement of chip components and large ICs. Front-rear head collaboration reduces motion loss, achieving theoretical throughput of 42,000 CPH (chip components) and 14,000 CPH (IC components) per IPC-9850 standards.
• 自适应力调制: 0.5N–50N dynamic pressure control accommodates sensitive components (e.g., LEDs) and PoP (package-on-package) assemblies.
• Laser Metrology System (LNC): Inspects 0402 (01005 imperial) to 33.5mm square components with ±40μm accuracy (Cpk≥1), monitoring real-time X/Y position and Z-height.
• MNVC Vision Module: Supports 3–100mm square and 50×180mm odd-form components (e.g., long connectors) with ±30μm accuracy (high-resolution camera optional).

喂料机系统

Versatile Feeding Platform

• RF Feeder Technology: Standard dual-track powered feeders support 8–56mm tape, with 160-station capacity (8mm tape equivalent), compatible with tube/tray and JEDEC-standard components.
• 智能喂食: Automatic tape splicing and real-time shortage alerts minimize manual intervention, enhancing production continuity.

PCB 加工系统

Modular Substrate Handling

• Single/Dual Track Capability:
  • Single-track: 50×50mm–610×590mm PCBs
  • Dual-track: 50×50mm–360×250mm PCBs
• Long-Board Extension: Two-stage clamping supports up to 905×590mm substrates for LED panel and large PCB production.
• Motorized Support Platform: Reduces transport vibration and shortens clamping time for improved placement stability.

视觉和检测系统

Advanced Metrology Solutions

• In-Flight Vision: Component recognition during head transit reduces idle time and optimizes throughput.
• Pick-and-Place Verification: Real-time imaging of pickup and placement events prevents defect propagation and enables rapid fault diagnosis.
• Optional 3D Inspection: Detects component coplanarity and height deviations to mitigate cold solder and tombstoning defects.

运动控制系统

High-Precision Mechanics

• 带磁悬浮的直线电机驱动器: X/Y axes achieve sub-micron resolution via 0.001mm magnetic scales, ensuring stability at high speeds.
• 双伺服 Y 轴驱动: Optimizes conveyor dynamics to reduce mechanical vibration and enhance placement repeatability.

Intelligent Software & Scalability

JaNets Production Management Suite

• Offline Programming: CAD import, trajectory optimization, and simulation reduce changeover time via intelligent path planning.
• Modular Integration: TR8S matrix tray server enhances odd-form component handling; compatible with JUKI RX-7 series for flexible line configuration.