NX-EF | Electronics X-ray Inspection System

Name: NX-EF | Electronics X-ray Inspection System - Nectec
Price: 9999.00 USD
Availability: InStock

The NX-EF machine is applied to detect welding defects in electronic components. It is capable of inspecting PCB, SMT assembly, IC packaging, BGA (Ball Grid Array), CSP (Chip Scale Package), semiconductor and other components. With its advanced technology, it can accurately identify various welding issues, ensuring the quality and reliability of electronic products.

类别 PCB BGA X 射线

说明

说明

功能和特点

X-Ray Tube Configuration：Adopts sealed tube style X – ray tube, with 90kv tube voltage, 200uA tube current, 5um details resolution, air cooling mode, and 125 (times) geometric magnification time.

Flat Panel Detector Specs：Features flat panel detector with 85um pixel size, 15361536mm pixel matrix, 130130mm effective imaging area, 20 Fps, and 16bit AD conversion digits.

Motion Control Capability：Motion control system offers 340mm Axis X, 330mm Axis Y, 300mm Axis Z, and the fixture rotates 360 degrees for Axis R.

规格

Note：The above information only represents general description and characteristics， which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement. The above information only represents general description and characteristics， which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement.
项目	模型	NX-EF
X 射线管	管式	密封管
	电子管电压	90 千伏
	电子管电流	200uA
	Details resolution	5um
	冷却模式	空气冷却
	几何放大时间	125（次）
平板探测器	像素大小	85um
	像素矩阵	1536*1536 毫米
	有效成像区域	130*130 毫米
	Fps	20
	AD 转换数字	16 位
运动控制系统	Axis X	340mm
	轴 Y	330mm
	Axis Z	300 毫米
	Axis R	The fixture rotates 360 degrees