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无铅焊膏产品
Nectec’s Lead-Free Solder Paste combines advanced alloy technology with rigorous quality control to deliver reliable, high-performance soldering solutions for modern electronic assembly. With features like excellent thermal stability, minimal defects, and a wide process window, it ensures consistent performance across diverse applications—from smart devices and LED components to automotive and power electronics. The product’s versatile alloy options and fine powder grades enable precision soldering for both standard and high-reliability requirements, while its lead-free composition aligns with global environmental standards. Trust Asahi to provide innovative, cost-effective solder pastes that meet the evolving needs of the electronics industry.
含铅焊膏
Nectec’s Lead Solder Paste provides a reliable and cost-effective solution for traditional electronic assembly processes, leveraging lead-based alloys to offer low melting points and robust soldering performance. With alloys like Sn63Pb37 and Sn62.9Pb36.9Ag0.2, the product ensures efficient wetting, minimal defects, and compatibility with diverse manufacturing techniques, from printing to reflow soldering. Ideal for industries requiring high-reliability joints—such as home appliances, automotive, and military electronics—it combines process adaptability with consistent quality, meeting the demands of legacy and high-volume production lines.
焊条
Nectec’s Solder Bars combine diverse alloy technology with rigorous quality control to offer reliable soldering solutions for electronic assembly. With alloys ranging from lead-free Sn-Ag-Cu systems to traditional Sn-Pb compositions, these bars cater to environmental standards (RoHS compliant) and legacy manufacturing needs. Key features—including excellent oxidation resistance, high joint integrity, and compatibility with wave/selective soldering—make them ideal for industries such as automotive, consumer electronics, and telecommunications. Backed by ISO 9001 and IATF 16949 certifications, Asahi ensures consistent performance, while global production hubs in Zhuhai, Vietnam, and Malaysia guarantee scalable supply and technical support for high-volume manufacturing.
焊线
Nectec’s Solder Wire combines pure tin materials with advanced antioxidant technology to deliver reliable soldering performance for diverse electronic assembly needs. Its flux-injected design ensures uniform wetting and minimal defects, while compatibility with automated/manual processes makes it suitable for high-volume manufacturing and precision repairs. With alloy options ranging from lead-free Sn-Ag-Cu (e.g., Sn96.5Ag3.0Cu0.5, 217–220°C) to traditional Sn-Pb (e.g., Sn63Pb37, 183°C), the product caters to both environmental standards and legacy applications. Backed by strict quality control, Asahi’s solder wire ensures consistent joint integrity, reduced production waste, and seamless integration into wave soldering, selective soldering, and other high-temperature processes.