설명

배치 헤드 및 레이저 계측 시스템

Multi-Head Parallel Architecture

• 24-Nozzle Multi-Head System: Four placement heads with 6 independent nozzles each enable synchronous pick-and-place operations, achieving ultra-high-speed throughput.
• LNC60 Laser Scanning Module: New-generation laser sensor supports parallel component identification across all 6 nozzles, delivering 20% faster recognition throughput than legacy 4-nozzle systems. Covers 0402 (0.4×0.2mm) to 33.5mm² components (QFP/CSP/BGA) with ±50μm (±3σ) measurement accuracy.
• 기내 부품 검증: Real-time laser inspection during high-speed head transit minimizes idle time and enhances placement efficiency.

Vision & Motion Control System

Advanced Drive Technology

• X/Y Axis Linear Servo Drives: Full closed-loop control with 0.001mm-resolution linear magnetic scales enables high-acceleration motion and sub-micron positioning accuracy.
• Non-Contact Magnetic Levitation: Frictionless linear motor design ensures maintenance-free operation, extended equipment lifecycle, and acceleration performance surpassing traditional lead screw systems.
• 듀얼 서보 Y축 작동: Optimizes conveyor stability during high-speed operation to mitigate vibration-induced placement errors.

피더 시스템

Hybrid Feeding Ecosystem

• 240-Station Feeding Platform: Supports mixed electric/mechanical tape feeders (8mm equivalent), accommodating up to 240 components for diverse production needs.
• 지능형 피딩 기술: eFeeders with automatic tape splicing and real-time shortage alerts reduce manual intervention and sustain uninterrupted production.

PCB 처리 시스템

다용도 기판 관리

• 표준/확장 폼 팩터:
  • L-type: 410×360mm
  • XL-type: 610×560mm
  • Extended: 800×560mm for ultra-long PCBs (LED lighting, automotive electronics).
• Servo-Driven Active Damping Platform: Reduces substrate vibration during fixturing, minimizing placement offsets and shortening setup time.

Software & Human-Machine Interface

Intelligent Production Orchestration

• 동적 궤적 최적화: AI-driven algorithms auto-generate optimal placement paths, achieving 90,000 CPH theoretical throughput under ideal conditions.
• 15″ Touchscreen HMI: Intuitive graphical interface for real-time monitoring of placement status, mispick rates, and fault diagnostics.
• Modular Line Integration: Compatible with JUKI KE series for flexible, mixed-model production line configurations.

Vacuum System & Maintenance Design

Reliability Engineering

• High-Efficiency Vacuum Pump: Reduces air consumption while enhancing component pickup stability, lowering mispick rates.
• Tool-Less Modular Maintenance: Quick-change nozzles/feeders and lubrication-free eFeeder design minimize downtime and maintenance costs.
• Maintenance-Free Magnetic Drives: Non-contact levitation technology eliminates mechanical wear, extending service life.

Technical Advantages Summary

• Ultra-High Throughput: 90,000 CPH placement speed via linear servo drives and parallel laser inspection.
• Precision Metrology: ±50μm accuracy for fine-pitch components (QFP/BGA) with Cpk≥1.5 process capability.
• Scalable Flexibility: Supports hybrid feeding, extended-length PCBs, and multi-model line integration.
• Low Total Cost of Ownership (TCO): Magnetic levitation, modular design, and intelligent maintenance reduce operational expenses.