KE-3010A | High-Speed Modular Placement SMT Chip Shooter

Name: KE-3010A | High-Speed Modular Placement SMT Chip Shooter - Nectec
Price: 9999.00 USD
Availability: InStock

KE3010Aは、JUKIの第7世代モジュラー・プレースメントマシンであり、柔軟性と生産品質を向上させる最新の最先端技術です。

カテゴリージューキ

説明

In-Flight Centering Technology: Equipped with LNC60 laser sensor, enables on-the-fly positional, angular, and dimensional inspection of components during head transit. Covers 0402 (01005 imperial) to 33.5mm² components, including QFP, CSP, and BGA packages.
Metrology Performance: Achieves ±50μm accuracy (Cpk≥1.0) in laser recognition mode, with 20% faster inspection throughput than previous generations.
Real-Time Process Monitoring: Continuous tracking from component pickup to placement ensures stability and reduces misplacement risk.

6-Nozzle Parallel Architecture: Single placement head with 6 independent nozzles supports parallel pick-and-place operations, achieving theoretical throughputs of 23,500 CPH (chip components), 18,500 CPH (ICs with standard vision), and 9,000 CPH (ICs with MNVC imaging).
アダプティブ・フォース・モジュレーション: Automatically adjusts placement pressure for variable component heights (6mm/12mm) and geometries.

EF08HD Powered Dual-Track Feeders: Supports 8mm tape feeders with 160-station capacity (8mm equivalent), doubling traditional feeder density and reducing changeover time.
Mixed Feeder Compatibility: Supports electric (ETF) and mechanical (CTF/ATF) feeders for cost-effective legacy system integration.
Intelligent Material Handling: Smart Feeder technology enables automatic tape splicing and real-time shortage alerts for continuous production.

Hybrid Drive Technology: X/Y axes utilize lead screw drives with 0.001mm-resolution linear magnetic scales and full closed-loop control for high-speed, low-noise positioning.
デュアルサーボY軸アクチュエーション: Enhances conveyor stability during high-speed operation, minimizing vibration-induced errors.

Multi-Format Substrate Handling:
- Standard: M-type (330×250mm), XL-type (610×560mm)
- Extended: Up to 1,210×560mm for LED panel and display PCB production.
Motorized Support Platform: Reduces transport vibration and shortens fixturing time for improved placement repeatability.

Windows XP-Based HMI: Intuitive multi-language interface (Chinese/Japanese/English) for operator ease.
JANETS Offline Programming Suite: Enables CAD import, placement path optimization, and simulation debugging to enhance production efficiency.
Integrated Production Monitoring: Real-time fault code display, mispick rate tracking, and MES/ERP compatibility via built-in data interfaces.

ボードサイズ	M size (330×250mm)	はい
	L size (410×360mm)	はい
	L-Wide size (510×360mm) (optional)	はい
	XL size (610×560mm)	はい
	Applicability to long PWB (M size) (Applicability to long PWB is optional.)	650×250mm
	Applicability to long PWB (L size) (Applicability to long PWB is optional.)	800×360mm
	Applicability to long PWB (L-Wide size) (Applicability to long PWB is optional.)	1,010×360mm
	Applicability to long PWB (XL size) (Applicability to long PWB is optional.)	1,210×560mm
コンポーネントの高さ	6mm	12mm
コンポーネントの高さ	12mm	12mm
コンポーネント・サイズ	Laser recognition	0402(01005) ~ 33.5mm
	Vision recognition	3mm[When using MNVC. (option)] ~ 33.5mm
	Vision recognition	1.0×0.5mm[KE-3010A ： When using both high-resolution camera and MNVC. (option) ] ~ □20mm
プレースメント速度	最適	23,500CPH
	IPC9850	18,500CPH
	IC [Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)]	9,000CPH (Estimated value when using MNVC and picking up components simultaneous with all nozzles. MNVC is option in the KE-3010A.)
プレースメントの精度	Laser recognition	±0.05 mm (±3σ)
プレースメントの精度	Vision recognition	±0.04mm
フィーダー入力	Max.160 in case of 8mm tape (on a Electric double tape feeder) (When using Electric double tape feeder EF08HD.)
フィーダー入力