Deskripsi

1. Integrated Air-Cooled Storage System

   • Utilizes forced-convection air cooling to rapidly dissipate residual heat from PCBs post-reflow/wave soldering.

   • Customizable temperature control prevents thermal damage to sensitive components and accelerates flux solidification.

2. Side-Access PCB Storage Design

   • Optimized lateral PCB storage minimizes floor space (Dimensions: 1500×1495×1760mm, Model BF-350C).

   • Modular architecture supports high-density SMT line integration.

3. Heavy-PCB Handling Capability

   • Reinforced ball-screw width adjustment mechanism accommodates boards up to 1200×350mm.

   • Low-friction roller transmission  ensures smooth transport of multilayer/metal-core PCBs without slippage.

4. Flexible Buffer Management Modes

   • FIFO/LIFO Logic: Enables strategic PCB queuing for quality control.

   • Bypass Mode: Direct PCB pass-through for maintenance or urgent line reconfiguration.

5. Precision Adjustment & Retrieval

   • Ball-screw width adjustment (±0.2mm accuracy) for versatile PCB size compatibility.

   • Dedicated retrieval position function reduces operator access time during board handling.

6. SMEMA Integration & Standard Compliance

   • SMEMA communication interface synchronizes with AOI/SPI/pick-and-place machines.

   • Unified transport height ensures seamless SMT line interoperability.

7. Reliability & Serviceability

   • Enclosed structure mitigates dust contamination.

   • LED tricolor indicators provide real-time operational status.