说明

高速贴装性能

1. 吞吐能力:
   • Theoretical maximum placement speed: 30,000 CPH (single cantilever architecture, 6-axis coordinated motion). Actual speed varies by component complexity and program optimization.
2. 定位精度:
   • 标准芯片元件：±40μm (±3σ)
   • QFP 封装：±30μm (±3σ)
3. 元件处理范围:
   • Supports 0603 metric (0.6×0.3mm) to 55×55mm components (max height 15mm), including micro resistors/capacitors, ICs, and odd-form connectors (e.g., 75mm-long variants).

视觉和检测系统

1. 机载视觉技术:
   • 在头部遍历过程中实时识别组件，减少了空闲时间，提高了吞吐量。
2. Polygon Recognition Module:
   • Enhances odd-form component placement (e.g., BGA, QFN) with high-precision alignment for 55mm ICs.
3. Fixed-Mount Camera (FOV45):
   • Dedicated to PCB fiducial mark detection, ensuring substrate transport accuracy and mounting coordinate precision.

馈电系统结构

1. 供电供料器平台（eFeeder）:
   • Supports 120×8mm tape feeders, backward-compatible with SM series pneumatic feeders for seamless legacy system integration.
2. 智能拾取定位:
   • 优化元件拾取坐标，减少误拾率和材料浪费。
3. Smart Feeder Technology:
   • Enables automatic tape splicing and real-time shortage alerts to maintain production continuity.

PCB 加工能力

1. 基底尺寸:
   • Single-track mode: 50×40mm–460×400mm
   • Dual-track mode: up to 460×250mm per track
2. Expansion Options:
   • Optional upgrade supports 740×460mm substrates for LED/long-display PCB production.
3. 材料兼容性:
   • 可处理 0.38-4.2 毫米厚的印刷电路板，包括柔性和刚性基板。

运动控制和真空系统

1. 双伺服 Y 轴驱动器:
   • 增强高速运行时输送机的稳定性，最大限度地减少振动引起的放置误差。
2. 优化的真空动力学:
   • Vacuum pump system ensures pickup consistency while reducing air consumption to 180NL/min for energy efficiency.

Intelligent Software & Maintenance

1. 自适应校准套件:
   • 动态校正拾音器位置、磁头对齐和轨道坐标，以补偿环境变化。
2. Modular Tooling Design:
   • Automatic nozzle changer supports 20+ configurations (standard/optional), streamlining maintenance and changeovers.