说明

高速贴装性能

1. 吞吐能力:
   • Theoretical maximum placement speed: 78,000 CPH (dual gantry architecture, 20 independent spindles in concurrent operation). Actual throughput varies by component complexity and program optimization.
2. 定位精度:
   • Standard components (Chip): ±40μm (±3σ)
   • IC components: ±50μm (±3σ)
3. 元件处理范围:
   • Supports 0402 metric (01005 imperial) to 14mm square ICs (height ≤12mm), covering micro resistors/capacitors and odd-form devices.

Modular System Design

1. Dual Gantry Architecture:
   • Each gantry equipped with 10 independent spindles for synchronous pick-and-place operation, optimizing production efficiency.
2. 机载视觉技术:
   • Real-time component recognition during head transit reduces idle time and enhances overall equipment effectiveness (OEE).

喂料机系统

1. Versatile Feeding Platform:
   • Supports 120×8mm eFeeder stations with backward compatibility for SM series pneumatic feeders, enabling seamless integration with legacy systems.
2. Smart Feeder Technology:
   • Industry-first automatic tape splicing and real-time material shortage alerts minimize manual intervention for continuous production flow.

运动控制系统

1. 双伺服 Y 轴驱动器:
   • Optimizes conveyor stability with software-based vibration dampening, reducing mechanical resonance during high-speed operation.
2. 自适应校准套件:
   • Dynamically compensates for pickup position, head alignment, and track variations to adapt to changing production environments.

视觉和检测系统

1. High-Resolution Fiducial Camera:
   • Enables precise PCB fiducial mark recognition and component alignment, enhancing odd-form component placement (e.g., BGA, connectors).
2. Optional 3D Laser Metrology:
   • Post-pick component height and coplanarity inspection (requires optional module) to prevent cold solder defects.

PCB 加工能力

1. 基底尺寸:
   • Single-track mode: 50×40mm–610×460mm (expandable options available)
   • Dual-track mode: 50×40mm–460×250mm
2. Thickness Range:
   • 0.38–4.2mm, compatible with flexible and rigid PCBs.