SIPLACE-SX | Cantilever modular placement machine

Name: SIPLACE-SX | Cantilever modular placement machine - Nectec
Price: 9999.00 USD
Availability: InStock

SIPLACE SX is the first placement solution that is fully scalable with demand thanks to its unique interchangeable gantries. A great way to add capacity when needed or reduce capacity when things slow down. We call it ASMPT Capacity-on-Demand.The SIPLACE SX-Series puts scalability and flexibility at the top of the list. Users are able to introduce new products quickly, change setups without stopping the line and produce any batch size with high utilization and efficiency.Whether in automotive, automation, medical, telecommunication or IT infrastructure – the ASMPT SX-Series meets all requirements in terms of quality, process reliability and speed.

类别 ASM

说明

说明

1. Modular Cantilever Architecture & Placement Head System

Cantilever Modularity Design

The SIPLACE SX remains the world’s sole placement platform enabling dynamic capacity scaling via cantilever reconfiguration (addition/removal). Users can adjust cantilever count within 30 minutes to adapt to fluctuating production demands, preserving capital investments. Configurable as single-cantilever (SX1) or dual-cantilever (SX2) setups, it ensures scalable throughput without requiring production line layout modifications.

Diverse Placement Head Configurations

SpeedStar CP20 Head: Handles 0201 metric (0.2×0.1mm) to 8.2×8.2×4mm components with a placement throughput of 43,250 CPH and ±35μm @3σ positional accuracy, optimized for high-speed/high-precision SMT applications.
MultiStar & TwinStar Heads: Accommodate large complex components (up to 50×150mm, 240g) with up to 100N placement force, supporting through-hole technology (THT) processes like pin bending.
CPP Placement Head: Enables pick-collect-mix mode switching, compatible with components ≤15.5mm in height and ≤20g in weight.

2. Vision Inspection System & Imaging Algorithms

High-Resolution Visual Processing

The advanced camera system integrates multi-angle illumination and multi-exposure imaging to generate 3D component models, optimizing process control for detecting features like pin coaxiality and component coplanarity. LED centering technology achieves top-surface fiducial alignment, enhancing placement accuracy for odd-form components (e.g., BGA, QFP).

Laser Recognition Technology

Real-time laser profilometry tracks component Z-height and X/Y position, mitigating errors from contaminated/worn nozzles. Supports non-contact placement to protect sensitive devices during handling.

3. Feeder System Compatibility Design

Feeding Capacity & Flexibility

Standard 120-station 8mm tape feeder configuration supports both small-batch multi-variant and mass production. Open-architecture third-party feeder interfaces enable rapid integration of specialized feeders (e.g., GlueFeeder X, Measuring Feeder X). The system accommodates tube/tray components and JEDEC-standard trays, paired with Smart Feeder technology for automatic tape splicing and material shortage alerts.

4. PCB Processing Capabilities

Substrate Handling & Conveyance

Standard support for 50×50mm–610×590mm PCBs; expanded configurations process up to 1,525mm-long substrates (e.g., LED panels), compatible with flexible and rigid boards. The intelligent conveyor module features automatic pin support (Smart Pin Support) to dampen transport vibration and enhance placement stability.

5. Intelligent Software & Automation Interfaces

Smart Operational Features

Nozzle ID Management: Automatically verifies nozzle condition, enabling intelligent selection/replacement across 320 nozzle positions to prevent misplacement errors.
预测性维护系统: Real-time sensor monitoring triggers proactive maintenance alerts, reducing unplanned downtime.
Intelligent Operator Guidance: Stepwise wizards assist with component placement troubleshooting (e.g., height calibration, fiducial mark alignment), minimizing setup time.

开放式自动化接口

Supports IPC-CFX and IPC-9852-Hermes communication protocols for seamless MES/ERP integration, ensuring full-process data traceability in automotive electronics manufacturing.

6. Scalable Application Solutions

Odd-Shaped Component (OSC) Processing Kit

Facilitates placement of 200×110×25mm, 160g components (e.g., heat sinks, connectors) with integrated automatic feeding and in-process inspection workflows.

Automotive Electronics Solution

In collaboration with the DEK TQ L printing platform, it meets high-precision/high-reliability SMT requirements, enabling end-to-end process traceability for automotive-grade production.

规格

Technical data*	SIPLACE SX1	SIPLACE SX2
Placement speed**	43,000 cph	86,500 cph
Placement speed(IPC)	33,000 cph	66,000 cph
Feeder capacity	120 x 8mm slots
Component spectrum	0201(metric) to 200 mm x 110 mm x 50 mm
电路板尺寸	50 mm x 50 mm to 1,525 mm x 560 mm
Machine dimensions (L x W x H)	1.5mm x 2.8m x 1.8m
Placement heads	Placement Head CP20P, Placement Head CPP, Placement Head
Placement accuracy	22 μm @ 3 σ (with Placement Head TH)
Conveyors	Single-track conveyor, flexible dual-track conveyor