说明

置放头系统

12-Spindle + 2θ-Axis Multi-Nozzle Head

• Hybrid Placement Architecture: Supports mixed placement of 0201 metric (0.2×0.1mm) micro-components to 120×90mm odd-form devices (BGA, CSP, connectors) with a theoretical throughput of 45,000 CPH under ideal conditions.
• Adaptive Z-Axis Control: AC servo-driven dynamic pressure modulation (0.1–50N) adapts to component thickness (up to 30mm) to prevent damage to fine-pitch components.
• Dual-Angle Rotation Capability: ±180° θ-axis rotation ensures precise polarity alignment for polarized components.

视觉和检测系统

Dual-Precision Metrology Suite

• Tiered Placement Accuracy:
  • Class A (Chip Components): ±40μm @ 3σ
  • Class B (IC Components): ±25μm @ 3σ (Cpk≥1.33 for fine-pitch applications)
• Combined Vision-Vacuum Verification:
  • Image recognition for lead coplanarity and polarity checks.
  • Vacuum pickup sensors validate component retention, reducing mispick rates to <0.03%.
• Multi-Sensor Imaging: Standard vision camera + laser profiler enable rapid inspection of chip and odd-form components.

喂料机系统

混合喂养生态系统

• Expanded Feeder Compatibility:
  • F3 series electric feeders (8–88mm tape)
  • F1/F2 series pneumatic feeders (8–56mm tape)
  • Stick feeders and JEDEC-standard tray systems
• 180-Station Capacity (8mm Tape Equivalent): Supports simultaneous reel/tray/stick feeding for high-mix production.
• 智能喂料技术: Auto-tape splicing and real-time shortage alerts minimize manual intervention.

PCB Processing Capability

超宽基底处理

• Standard/Extended Dimensions:
  • Minimum: 50×30mm
  • Standard: 1,455×510mm
  • Maximum: 1,830×510mm (LED panel/industrial board compatible)
• Buffer Module Optimization: Entry/exit buffers support 540×510mm PCBs for high-frequency changeover scenarios.
• High-Velocity Conveyor System: 900mm/sec transport speed with active clamping and auto-width adjustment ensures ±0.1mm positioning accuracy.

运动控制系统

Precision Linear Drive Technology

• 磁悬浮驱动器: X/Y axes with 0.001mm-resolution magnetic scales achieve sub-micron stability (±15μm repeatability) at high speeds.
• Dual-Servo Y-Axis Stabilization: Reduces conveyor vibration by 40% during high-speed placement, ensuring long-substrate positional consistency.

软件和智能功能

Multilingual Production Platform

• Global HMI Support: Japanese, Chinese, Korean, and English interfaces for cross-regional production management.
• VIOS Automation Suite:
  • Real-time placement diagnostics with error correction prompts.
  • Integrated path optimization reduces changeover time to <8 minutes.
• Offline Programming Workflow: CAD data import with 3D simulation debugging enhances production efficiency by 25%.