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S10 | 3D Hybrid Universal Module Placement Machine
The S10 model has 3D placement capabilities. It can realize 3D placement with interactive solder paste dispensing and component placement through the newly developed interchangeable dispensing head; it can be expanded to 3D MID placement, and can operate on concave and convex, inclined and curved surfaces to meet the needs of automotive, medical, communication equipment and other fields. It can handle large and long substrates with a maximum size of L1,330 x W510mm (when the buffer function is not used), and can be accurately positioned by laser sensors to adapt to PCBs of different shapes and sizes. It also has a variety of component processing: it can handle components from 0201mm to 120 x 90mm, including BGA, CSP, connectors, etc.; the maximum component height is 30mm (including substrate thickness); the maximum feeder capacity is 90 types (converted to 8mm tape), and supports multiple feeding methods.
Its placement speed and accuracy have reached 0.08 seconds/CHIP (45,000CPH) under the best conditions for 12-axis 20-head unit, CHIP placement accuracy ±0.040mm, IC placement accuracy ±0.025mm, and placement angle ±180 degrees. Its equipment size is L1,250 x D1,750 x H1,420mm and weighs about 1,200kg. It also has negative pressure and image dual component return detection function and color reference mark recognition camera with new lighting unit to improve recognition accuracy; and supports multi-language operation interface. Its feeder compatibility is strong, and new and existing material change trolleys can be mixed and used.
- 说明
说明
置放头系统
12-Spindle, 20-Nozzle Multi-Axis Head
喂料机系统
Hybrid Feeding Infrastructure
印刷电路板处理系统
Ultra-Flexible Substrate Management
视觉和检测系统
Advanced Quality Assurance Suite
运动控制系统
Precision Motion Architecture
辅助系统
Global Production Readiness
规格
模型 | S10 |
Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) |
Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm |
Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm |
Board thickness | 0.4 – 4.8mm |
Board flow direction | Left to right (Std) |
Board transfer speed | Max 900mm/sec |
Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) |
Placement accuracy A (+3) | CHIP +/-0.040mm |
Placement accuracy B (+3) | IC +/-0.025mm |
Placement angle | +/-180 degrees |
Z axis control / Theta axis control | AC servo motor |
组件高度 | Max 30mm*1 (Pre-placed components: max 25mm) |
适用组件 | 0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
Component package | 8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray |
Drawback check | Vacuum check and vision check |
Screen language | English, Chinese, Korean, Japanese |
Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
Component types | Max 90 types (8mm tape), 45 lanes x 2 |
Transfer height | 900 +/- 20mm |
Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg |
