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SMT and especially SMT pick and place machines are officially on an upward trend. The reason behind it lies on the following stats: from 2021 to 2025, the global SMT assembly equipment market is expected to grow by USD 627.46 million, with the market projected to grow at a compound annual growth rate (CAGR) of 6.04% by 2024. Based on an analysis of various regions and their contributions to the global market, Technavio estimates that China, the United States, Germany, Japan, and the United Kingdom will remain the leading markets for SMT assembly equipment. By 2024, the consumer electronics, automotive, and communications segments are expected to become one of the primary drivers of the market, with significant implications for end-users. There is a total of seven aspects that are affecting this industry.
第一方面，高精度和灵活性。电子设备正朝着更高精度、更快速度、更易使用、更环保和更灵活的方向发展，以适应行业竞争、更短的新产品发布周期和环境要求。拾取贴装头可自动切换，并可进行点胶、印刷和检测反馈，从而实现更高的贴装精度稳定性以及元件与基板窗口之间的更大兼容性。
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Second aspect, high speed and miniaturization. To achieve high efficiency, low power consumption, minimal space requirements, and low cost, there is an increasing demand for high-speed, multi-functional pick-and-place machines that offer both high pick-and-place efficiency and multi-functionality. Multi-track, multi-workstation pick-and-place production models can achieve productivity levels of around 84,000 CPH like Nectec’s NT-T5, while the footprint and power consumption of the equipment continue to decrease.
第三方面，半导体封装与 SMT 集成。电子元件的微型化、多功能化和精密化推动了半导体封装与表面贴装技术的融合。POP（Pop-up Package）和三明治工艺等技术在高端智能产品中得到广泛应用，大多数品牌表面贴装设备公司都提供倒装芯片设备。
Fourth aspect, path to intelligence and automation. Driven by concepts such as Industry 4.0 and Made in China 2025, SMT equipment is being combined with technologies such as artificial intelligence and the Internet of Things to achieve automated production, intelligent detection, and fault prediction, thereby improving production efficiency and quality while reducing labor costs.
第五个方面，绿色制造。电子行业越来越重视可持续发展。SMT 设备制造商注重环境保护，开发节能、低污染的设备，以减少能源消耗和有害物质排放，如使用环保焊料、优化设备能耗管理等。
第六方面，先进检测技术集成。为确保电子产品的质量，3D SPI、AOI、AXI 等先进检测技术与 SMT 设备深度融合，实现实时在线检测和反馈，在兼顾检测精度和速度的同时，提高缺陷检出率和准确性。
最后一个方面是系统集成。SMT 设备正朝着集成系统的方向发展，将装配、物流、包装和测试结合在一起。通过 MES 等系统，可以实现全过程跟踪和控制，提高生产协调和效率，优化生产流程。