Against the backdrop of explosive growth in the new energy vehicle market, automotive electronics are undergoing a comprehensive upgrade characterized by “high density, high reliability, and high complexity.” From electronic control units and battery management systems to intelligent cockpit modules, the integration and precision requirements for electronic components far exceed those of traditional automobiles. However, most automakers’ SMT production lines still adhere to equipment standards from the consumer electronics era, facing challenges such as yield fluctuations, insufficient process compatibility, and excessive carbon footprints. We will dive from the pain points, upgrade methods and case studies to logically discuss and analyze the purpose of upgrading SMT manufacturing techniques behind these new energy vehicles.

First, new energy vehicles require sophistications from SMT pick and place machines. They are broken down into three categories. First category is precision and reliability. This is the base protection for the safety of not only the passengers but the vehicle itself. The SMT requirements for this category are miniaturization of the chip component: where BMS chips and IGBT driver boards must support 01005 components (0.4 mm × 0.2 mm) and 0.3 mm pitch QFN packaging, with dynamic placement accuracy of ≤0.025 mm@3σ. And compatibility under severe working environment: where in-vehicle electronics must withstand temperature cycles ranging from -40°C to 150°C, and the solder joint defect rate must be less than 50 ppm (fifty parts per million); Second category is efficiency and flexibility. This is generally for the response to the capacity ramp-up pressures. The SMT requirements for this category are multi-product mixed line: where with the help of the acceleration of vehicle model iteration, the line changeover time needs to be compressed to less than 15 minutes. 

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And production capacity demand: where the monthly production capacity of a single SMT production line generally needs to exceed 50 million points, with a utilization rate of ≥95%; Third category is green manufacturing. This is for hard constraints under ESG policies. The SMT requirements for this category are lead-free manufacturing: where compliant with RoHS, REACH, and other regulations, with solder heavy metal residue ≤0.1%. And carbon footprint management: where equipment energy consumption needs to be reduced by 20%-30%.

Second, the SMT production line for the new energy vehicles has four technological pain points that are worth mentioning. First pain point is insufficient accuracy leads to yield bottlenecks. The reason behind it is because when traditional pick and place machine mounts 01005 components, the yield rate is generally less than 98%, and rework costs increase dramatically; Second pain point is low automation adoption. The reason behind it is because the reliance on manual adjustment results in a scrap rate as high as 0.2% and delays in process parameter optimization; Third pain point is poor environmental compliance. The reason behind it is because there’s a high possibility that the lead-based solder and high-energy-consuming pick and place machines, reflow machines face export sanctions risk; Last pain point is weak flexible production capacity. The reason behind it is because generally changing lines takes more than 30 minutes, which making it difficult to cope with fluctuations in orders for multiple vehicle models.

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Third, we want to discuss the technical transformation path. Which from our perspective it can easily be the combination of hardware upgrades, software empowerment and green transformation. As we break it down into three main aspects. Let’s dive deep into each aspect with their reasonings. First, for hardware upgrades, we want to focus on strengthening the foundation of precision manufacturing. There are two types of machines that can be upgraded: high-precision pick and place machines: where we can replace magnetic levitation linear motor, improving dynamic accuracy to 0.035 mm@3σ and upgrade optical alignment system to support 30 μm-level mark point recognition. And nitrogen reflow solder machines: where we can manage oxygen content control to be less than and equal to 100 ppm, reducing solder joint oxidation and improving yield by 1.5%. Second, for software empowerment, we want to focus on building the core of a smart and automated guided factory. There are two types of intelligent systems that can be optimized: AI process optimization system: where it provides machine learning and real-time analysis of material ejection data to dynamically adjusts the nozzle path, reducing the material ejection rate from 0.2% to 0.08%. Then using digital twin technology to simulate the production process, shortening the new product introduction cycle by 60%. And deep MES integration: where it provides real-time monitoring of overall equipment effectiveness, energy consumption, yield and other indicators, with a 70% improvement in response speed to anomalies. Third, for green transformation, we want to focus on compliance and cost reduction. There are two plausible ways to achieve such purpose: lead-free solder technique: where it uses Sn-Ag-Cu alloy. And power consumption intelligent management: where we can add a variable frequency module and a heat recovery system so that the equipment’s power consumption is reduced by 25%.

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Fourth, we want to discuss a case study regarding this upgrade in the past. The background is one of our past clients, a certain new energy vehicle manufacturer, who had faced huge penalty fees due to delivery delays caused by insufficient BMS module yield. What they did can be broken down into three steps: first they purchase a few Nectec’s NT-T5 pick-and-place machines with precision of 0.035 mm @ 3σ. Then, they added AI material discharge warning module and MES interface to these machines. Last, they replaced nitrogen reflow soldering furnace with lead-free solder paste. As a result of this upgrade, they have accomplished a few remarks: yield rate increased to 99.5%, reducing annual repair costs by 12 million yuan; Production capacity ramp-up speed increased by 50%, order delivery cycle compressed to 18 days; 28% reduction in carbon footprint per unit.

Fifth, we want to discuss future prospect of this production line upgrade trend. It is crucial to mention such context because it supports technology convergence and regionalized manufacturing. First, we envision that laser welding, 3D SPI inspection, and other technologies are integrated into the SMT production line to achieve nanometer-level process control. Second, it is obvious that the demand for used equipment in Southeast Asia, Eastern Europe, and other regions is high. It is a must and one of the factors to win the race that to provide localized payment method and fast service to clients. Last, as the world is continuing to promote renewable and green energy, we will see more of photovoltaic power supply, equipment remanufacturing, and carbon credit trading upgrades in the future.

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To conclude, the technological transformation of SMT equipment for energy vehicles is by no means a simple hardware replacement, but rather a comprehensive upgrade of the entire chain, combining “precision craftsmanship + intelligent systems + green standards.” For automakers, choosing a partner with cross-process integration capabilities and a global service network, such as Nectec, will be the key to breaking through the dual pressures of production capacity and compliance.