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SMT refers to a technology in which surface-mount components are soldered onto the surface of a printed circuit board. Compared with traditional through-hole assembly technology, this technology has the advantages of high assembly density, small product size (e.g., 40% to 60% reduction in size), light weight (e.g., 60% to 80% reduction in weight), high reliability, strong vibration resistance, and ease of automation. According to a leading international financial research institution, the global PCB market is projected to reach a total value of US$73 billion in 2024, representing a year-on-year growth rate of 6%.
Looking ahead, as AI technology continues to penetrate end-user devices at an accelerated pace, the explosive growth of global AI-enabled edge devices will serve as a key driver for structural upgrades within the PCB industry. Based on the institution’s data, the global PCB industry’s output value is expected to grow at a compound annual growth rate of 5% between 2025 and 2029, reaching over 90 billion U.S. dollars by 2029. Against the backdrop of the PCB industry’s strong growth momentum, the corresponding SMT assembly industry is also developing in tandem, with demand for X-ray inspection equipment rising in parallel. The potential market capacity for X-ray inspection equipment is expected to grow further.
In the field of electronic manufacturing X-ray inspection, microfocus X-ray inspection equipment can reveal the internal structure of components, detecting various defects hidden within the package, including cold solder joints, bridging, insufficient solder, voids, and missing components. It can also identify fractures in the inner layers of PCBs and internal structures that are invisible to the naked eye or undetectable by online testing. This effectively verifies soldering defects in BGA, CSP, and other packaging processes within PCBs, providing the SMT surface mount industry with a one-stop inspection solution, optimizing the SMT process flow, and enhancing quality assessment capabilities.
Further analysis reveals that the value of X-ray inspection extends far beyond helping customers identify defects. It is also a powerful process control and optimization tool. Through statistical analysis of inspection data and continuous monitoring of BGA solder joint void rates, dimensions, and roundness, customers can gain insights into subtle fluctuations and potential trends in the SMT production process. This data-driven feedback loop enables engineers to precisely adjust solder paste printing parameters, placement accuracy, or reflow soldering temperature curves, thereby eliminating defects at their inception. This marks a transition from detection to prevention, fundamentally improving product yield rates and overall production efficiency.
To conclude, as PCBA continues to evolve toward higher density, reliability, and complexity, X-ray inspection is no longer a mere auxiliary tool, but rather a strategic investment that safeguards product quality, earns customer trust, and strengthens market competitiveness. In the increasingly competitive market, companies that embrace and effectively utilize this advanced inspection technology, such as Nectec, will undoubtedly gain a competitive edge and confidently address future technical challenges.