Description

Placement Head System

High-Speed Universal Integration Head (HM Head)

• Dual Cantilever (Dual-Beam X-Axis) Architecture: Equipped with HM10 high-speed placement heads, achieving theoretical throughput of 81,000 CPH (Yamaha certified conditions) or 95,000 CPH (third-party tested scenarios). Supports 0201 metric (0.25×0.125mm) to 55×100mm components (max height 15mm).
• Adaptive Force Modulation: Dynamically adjusts placement pressure by component type (e.g., MLCC, fine-pitch ICs) to prevent damage during insertion.
• Odd-Form Placement Head (FM Head): FM5 multi-function head handles 03015 metric (0.3×0.15mm) to 55×100mm odd-shaped components (e.g., heat sinks, connectors, max height 28mm) for mixed-model assembly.
• Theta-Axis Rotation Control: ±180° component rotation capability ensures precise polarity alignment for polarized components.

Vision & Inspection System

High-Precision Metrology Suite

• Laser Profilometry System: Real-time 3D component inspection for position, angle, and height with ±35μm (±25μm @ Cpk≥1.0, 3σ) accuracy, meeting IPC-9850 process capability standards.
• Multi-Camera Vision Module:
  • Detects lead coplanarity and solder ball integrity for BGA/QFP packages.
  • Optional upgrade supports 3D solder paste inspection (SPI) for advanced process control.

Feeder System

High-Density Material Handling Platform

• Fixed-Position Feeder Bank: Accommodates up to 140×8mm tape feeders, compatible with tube/tray components for high-volume production.
• Batch Feeder Exchange System: 128-station quick-change cassette reduces changeover time to <5 minutes, ideal for high-mix environments.
• Automated Tray Handling:
  • Fixed mount: 30-layer tray capacity
  • Cart-based: 10-layer tray capacity
  • Optimized for rapid changeover in mixed-component workflows.

PCB Processing System

Large-Format Substrate Handling

• Dual-Track Configuration:
  • Same-width substrates: 50×50–810×356mm
  • Mixed-width expansion: Up to 810×662mm
• Single-Track Configuration: Supports 50×50–810×490mm PCBs, ideal for LED panel and industrial board production.
• Active Substrate Stabilization: Auto-adjusting track width and support pins minimize warpage during transport (speed up to 1,200mm/sec), ensuring ±50μm placement stability.

Motion Control System

Precision Mechanical Design

• Linear Motor Drives with Closed-Loop Control: X/Y axes utilize magnetic levitation and 0.001mm-resolution magnetic scales for micron-level positioning (±25μm) at high speeds (optimized acceleration profiles).
• Dual-Servo Y-Axis Synchronization: Ensures conveyor stability for long substrates, maintaining accuracy consistency across 810mm board lengths.

Software Ecosystem

VIOS Industrial Automation Platform

• Advanced Programming Suite: Offline CAD import, 3D placement simulation, and dynamic path optimization reduce changeover time to <3 minutes.
• Smart Factory Connectivity:
  • Real-time OEE monitoring with mispick rate tracking and fault code diagnostics.
  • Supports IPC-CFX, SECS/GEM protocols for seamless MES/ERP integration.
• Predictive Maintenance via IoT Sensors: Real-time monitoring of head wear, feeder performance, and thermal stability, with proactive alerts to minimize unscheduled downtime by 80%.