Description

Placement Head System (P20 High-Precision Placement Head)

1. Throughput Performance:
   • Achieves up to 100,000 CPH under ideal conditions for micro-components (e.g., 0201 metric), enabling high-speed single-reel tape pickup and placement.
2. Component Compatibility:
   • Optimized for ultra-small components (0201 metric and above) and small ICs, handling 0201 to 5mm² components with ≤3mm height, suitable for high-density applications like LED edge lighting.
3. Low-Force Placement Technology:
   • Independent control of nozzle plunge force (downward pressure) and retraction velocity minimizes impact on components/substrates (especially flex PCBs), ensuring stable micro-component placement.
4. Real-Time Vision Correction:
   • Integrated advanced centering and inspection vision systems automatically correct post-pick component positional deviations, achieving ±40μm accuracy (Cpk≥1) and reducing flip defects.
5. On-The-Fly Inspection:
   • Verifies component presence and polarity in real-time before placement, ensuring process compliance.

Vision System

1. Coaxial Illumination Technology:
   • XO coaxial lighting enhances image clarity for 0201-class micro-components, improving recognition accuracy and stability.
2. Multi-Functional Inspection:
   • Real-time detection of missing components, misorientation, and automatic pickup position recalibration to enhance pick success rate.
3. Fiducial Mark Recognition:
   • High-precision substrate fiducial alignment compensates for warpage/positional deviations, ensuring placement consistency.
4. Substrate Handling Modes:
   • Single Track: 50×50–510×450mm PCBs (BOC, Bad Mark, and 2D barcode reading supported for 50–350mm length).
   • Dual Long-Board Mode: Simultaneously processes two ≤420mm-length substrates to optimize dual-board production efficiency.

Feeding System

1. High-Density Feeding Architecture:
   • Dual 8mm tape reels in single 17mm feeder slots (RF08AS model) enable 56-type feeder capacity, supporting 8–88mm tape and hybrid small-to-large component feeding.
2. Adaptive Pickup Calibration:
   • Dynamic feeder position adjustment based on component recognition ensures stable pickup.
3. Batch Change Trolley:
   • Supports mixed electric/mechanical feeder configurations for rapid batch replacement, reducing changeover time.
4. Feeder Status Visualization:
   • LED indicators provide real-time operational status; fault flashing locates problematic feeders.
5. Legacy Compatibility:
   • Supports existing mechanical feeders and batch trolleys for asset protection, with optional tape/tray feeding modules.

Motion Control System

1. Compact Modular Design:
   • Lightweight gantry architecture (998mm width) delivers industry-leading placement efficiency per square meter.
2. Precision Mechanics:
   • XY-axis repeatability of ±40μm (Cpk≥1); Z-axis height compensation ensures vertical placement accuracy.
3. Flexible Substrate Handling:
   • Single-track: Up to 510×450mm PCBs; dual-track: Two ≤420×250mm PCBs simultaneously, adapting to mixed-variety production.
4. Substrate Stabilization:
   • Vacuum chuck and mechanical clamping mechanisms reduce vibration during high-speed placement, enhancing stability.

Software Ecosystem

1. End-to-End Process Management:
   • Offline programming, multi-machine data sharing, and real-time equipment monitoring (via Factory Dashboard) optimize line balance with CAD data integration.
2. Traceability Monitoring:
   • Real-time tracking of placement head performance, recording pick errors and anomalies to identify faulty feeders/nozzles for rapid diagnostics.
3. Defect Mark Propagation:
   • Integrates upstream AOI bad mark data to skip defective PCB areas, reducing re-inspection time.
4. Intelligent Material Scheduling:
   • Auto-triggered replenishment alerts linked to automated warehousing ensure uninterrupted production.
5. Low-Force Placement Setup:
   • Adjustable nozzle plunge speed/force for flex PCBs and micro-components to prevent substrate deformation.
6. Multi-Lingual Support:
   • English GUI and documentation, with optional remote monitoring and diagnostics.

Power & Pneumatics

1. Power Supply:
   • Three-phase AC 200V/220V (430V with transformer); 2.1kVA apparent power, energy-efficient design.
2. Pneumatic Requirements:
   • 0.5±0.05MPa air pressure; 20L/min ANR standard consumption ensures stable component pickup/placement.