Description

1. Core Design Philosophy: Three “Zero” Objectives

Zero Placement Defects

• Pre-Pick: Detects component absence, tombstoning, flipping, pin component polarity, and height measurement (±0.05mm accuracy).
• Pre-Placement: 3D vision coplanarity inspection (e.g., BGA solder ball integrity, QFP lead coplanarity, ±0.02mm accuracy) and LCR in-circuit electrical testing (resistance/capacitance/inductance verification) to reject non-conforming components.
• Post-Placement: Residual component detection to prevent double placement or omissions.
• Laser Substrate Warpage Compensation: Pre-placement scanning (±0.1mm accuracy) dynamically adjusts Z-axis height for substrates with ≤±0.5mm warpage, ensuring stable placement.

Zero Machine Operators

• Smart Loader: Full automation of material replenishment and changeovers per production schedules, supporting unattended tape/tray/wafer feeder replacement to eliminate manual errors/delays.
• Staging Buffer Integration: Pre-loads next-workorder feeders in line-side buffers for <5-minute autonomous changeovers.

Zero Unplanned Downtime

• Placement heads, feeder units, and tray systems support tool-less rapid exchange, enabling maintenance without production interruption (OEE ≥95%).
• Predictive Diagnostics Suite: Real-time monitoring of nozzle wear, feeder health, and motor temperatures with proactive maintenance alerts to prevent catastrophic failures.

2. Core Component Functions

Reconfigurable Modular Architecture

• M3(S) Module (325mm width): Optimized for 0201 (008004) to 7.5×7.5mm micro-components with 16,500 CPH throughput (H12L head), ideal for high-density mobile PCB and module assembly.
• M6(S) Module (650mm width): Handles large odd-form components (up to 74×74mm/32×180mm) with DX multifunction head, supporting press-fit placement (39.2–98N force adjustment) for connectors and power modules.
• Scalable Configuration: 2M/4M base platforms support up to 32 modules (M3(S) equivalent), covering 50×50–774×710mm single-track or dual-track 370×280mm parallel processing.

Intelligent Feeding Ecosystem

• Supports 8–88mm tape (7/13/15-inch reels) with M6(S) accommodating 130×8mm feeder stations and on-the-fly replenishment.
• Feeder ID Authentication: Automatic program matching to prevent mis-loading, with Fujitrax-enabled 3-minute pre-warning for material shortages.
• JEDEC-Compliant Tray/Wafer Handling:
  • Tray Unit-L: Processes 335×330mm trays (6 components/tray) with ±0.1mm vacuum gripper positioning.
  • Tray Unit-M: Handles 135.9×322.6mm trays (10 components/tray) and 2–12-inch wafer automation.

High-Precision Placement Head Technology

1. H12L High-Speed Head (12-nozzle):
   • Specialized for micro-components with low-force nozzles (impact ≤50gf) and real-time force feedback, suitable for 0.3mm-thin flex PCBs (±25μm @3σ, Cpk≥1.0).
2. DX Multifunction Head:
   • Auto-switching nozzles/fixtures (0603–74×74mm components) with integrated pressure sensors for adaptive force control, preventing component cracking/pad damage.
3. In-Flight Vision Alignment:
   • On-the-move component posture correction (θ ≤0.1° deviation) with real-time XYθ axis compensation for ultra-fine-pitch (0.24mm) placement accuracy.

Intelligent Software & Control

1. Fuji Flexa Programming Suite:
   • Offline CAD-to-path automation reduces programming time by 40%, supporting multi-machine program synchronization and version control.
2. Real-Time Production Dashboard:
   • Dynamic OEE analytics (availability/performance/yield) with <1-minute anomaly alerts for substrate warpage/nozzle wear.
3. Fujitrax Traceability System:
   • End-to-end data logging of 30+ parameters (placement coordinates, force, feeder ID) with PCB 2D code linkage for material-to-finished-goods traceability.
4. Optimized Placement Sequencing:
   • AI-driven path optimization based on component type/feeder location, reducing idle travel and enhancing throughput by 15%.