Beschrijving

Transportsysteem

               Multi-Size Substrate Handling:

• • Supports PCB dimensions up to 510×460mm (referencing DECAN S2 architecture).
  • Magnetic levitation track technology minimizes transport friction and enhances stability; reported “production deviation issues” may relate to system calibration or PCB clamping precision.

Vision-systeem

               Vision-technologie tijdens de vlucht:

• • Standard flying vision enables component verification during head transit, reducing idle time.
  • High-resolution camera achieves ±25μm placement accuracy; user-reported “placement offset” may require vision system parameter optimization or fiducial mark recalibration.
  • Optional 3D laser profiling module detects component coplanarity (e.g., BGA, QFN) to mitigate soldering defects.

Plaatsing Hoofd

               Multi-Nozzle Placement Module:

• • Enables simultaneous multi-component pickup with a throughput of ~80,000 CPH (vs. DECAN S2’s 92,000 CPH), optimized for medium-throughput, high-precision applications.
  • Dynamic pressure modulation automatically adapts force by component type, preventing damage to sensitive devices (e.g., LED dies, thin ICs).

Voedersysteem

                Aangedreven voederplatform (eFeeder):

• • Supports 8–56mm tape feeders; reported “high mispick rate” may stem from feeder calibration or tape tension inconsistencies.
  • Smart Feeder technology with automatic splicing and shortage alerts requires regular maintenance to reduce component jamming risks.

Motion Control Systeem

               Lineaire aandrijvingen:

• • X/Y axes achieve ±28μm positioning accuracy (DECAN-series comparable), with vibration suppression algorithms minimizing high-speed mechanical vibration.
  • User-reported “placement deviation” may necessitate servo parameter validation or mechanical wear inspection.

Software-ecosysteem

              Real-Time Trajectory Optimization:

• • Automatically generates component placement paths; “program optimization discrepancies” may require adjustments to component grouping or feeder station layouts.
  • Integrated fault diagnostics with pre-defined error codes (e.g., “C719 Z-axis error”) enables rapid hardware/program troubleshooting.

Technical Specifications & Feedback Summary

• Nauwkeurigheid bij plaatsing:
  • 0402 (01005 imperial) chips: ±40μm @3σ
  • ICs (Stage Vision): ±30μm @3σ
  • Production deviations may relate to vision calibration or Z-axis height adjustments.
• Feeder Performance:
  • Supports eFeeder/pneumatic feeders (120 stations); high rejection rates linked to feeder cleanliness or drive mechanism anomalies.
• Expandability:
  • Optional 3D inspection module and dual-track conveyor; modular design facilitates future upgrades.
• Onderhoud:
  • eFeeders require no lubrication; nozzles and vacuum lines need regular cleaning (user-reported high frequency suggests vacuum system sealing optimization).