説明

Placement Performance

1. スループット能力:
   • Maximum placement speed: 80,000 CPH (ideal conditions), achieved via dual gantry architecture with 20 independent spindles in synchronized operation.
2. 位置精度:
   • Standard components (e.g., 0201): ±25μm (Cpk≥1.0)
   • IC components (e.g., QFP/BGA): ±30μm (Cpk≥1.0)
3. コンポーネント取り扱い範囲:
   • Supports 0201 metric (0.25×0.125mm) to 55×55mm components (max height 15mm), including microchips, LEDs, and fine-pitch packages (QFP/BGA).

ビジョンシステム

1. 機内ビジョン技術:
   • Real-time component recognition during head transit reduces idle time and enhances throughput efficiency.
2. 高解像度画像モジュール:
   • 5MP camera enables precise alignment of micro-components (e.g., 0402, 0603).
3. Side View Inspection System:
   • Monitors nozzle condition and component orientation in real-time to prevent misplacement or omissions.
   • Optional 3D Laser Profiling: Detects component height and coplanarity to mitigate cold solder and tombstoning defects.

フィーダーシステム

1. Powered Feeder Platform:
   • 8-56mmテープ・フィーダー、チューブ/トレイ・コンポーネントに対応し、120ステーション（8mmテープ換算）の容量を持つ。
2. インテリジェント給餌技術:
   • Automatic tape splicing and real-time material shortage alerts minimize manual intervention for uninterrupted production.

モーション・コントロール・システム

1. Dual Gantry Linear Motor Drives:
   • Micron-level X/Y axis resolution with vibration dampening algorithms ensures high-speed placement stability.
2. アダプティブ・フォース・モジュレーション:
   • Dynamic pressure adjustment by component type prevents damage to sensitive devices (e.g., fine-pitch ICs).

ソフトウェアとインテリジェント機能

1. Dynamic Trajectory Optimization:
   • Auto-allocates component placement sequences to reduce gantry idle travel and enhance efficiency.
2. Family-Based Changeover:
   • Shared feeder/nozzle libraries across similar machines reduce changeover time by 40% for 同族 products.
3. Defect Mark Sharing:
   • Cross-equipment Badmark data sharing shortens overall production cycle by preemptively addressing recurring issues.