14 Agustus 2025
Teknologi
How Nectec's pick and place machines is leading the future of SMT technology advancement.
The company launched its first-generation SMT placement machine in 2008, at which time all core technical components were imported. However, after more...
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14 Agustus 2025
Teknologi
Core Applications and Technological Evolution of Nectec's SCADA Systems in SMT Chip Interconnection.
We will be discussing the core functions and architecture of SCADA Systems. SCADA (Supervisory Control and Data Acquisition) is a key infrastructure...
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13 Agustus 2025
Teknologi
Analysis of Core Technologies in SMT Electronic Component Assembly.
First, we would like to discuss about the core Analysis of SMT surface mount technology. SMT (Surface Mount Technology) is a core...
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13 Agustus 2025
Teknologi
How Nectec's NT-L12 shows up on the big stage for its compatibility and versatility to the sizes of PCB board
Taking Nectec's self-developed SMT pick and place machine NT-L12 as an example, this model adopts high-speed universal integrated technology, achieving a qualitative...
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13 Agustus 2025
Teknologi
Analisis dan Poin Utama Teknologi Pemasangan Chip SMT
Perakitan Surface Mount Technology (SMT) adalah proses inti dalam manufaktur elektronik modern, yang memungkinkan koneksi yang efisien dan tepat antara komponen dan cetakan...
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13 Agustus 2025
Teknologi
Teknologi pemasangan chip SMT: mendorong miniaturisasi papan pengembangan semikonduktor
In the explosive growth of portable electronic devices, the Internet of Things terminal form continues to evolve, semiconductor development board as the...
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17 Juli 2025
Teknologi
Pemasangan Chip SMT dan Semikonduktor: bagaimana mesin pick and place Nectec berperan dalam evolusi kinerja papan pengembangan melalui simbiosis teknologi
In the process of semiconductor technology continues to break through the physical limit, SMT (surface mount technology) as the core process of...
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17 Juli 2025
Teknologi
Detailed steps for soldering surface mount components on PCBs and the specifications of Nectec's pick and place machines
Bagaimana komponen listrik yang lebih kecil dari sebutir beras pada motherboard ponsel bisa "menempel" pada PCB dan menghantarkan listrik?
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