Description

Placement Head System

High-Speed In-Line Multi-Function Head (HM Head)

• 10-Nozzle Universal Module: Handles 0201 metric (0.25×0.125mm) micro-components to 100×55×15mm odd-form devices (BGA, CSP, connectors) with a peak placement rate of 52,000 CPH (IPC-9850 compliant).
• Precision Engineering: Achieves ±35μm placement accuracy (Cpk≥1.0) via thermally stabilized X-axis beam design, enabling ultra-dense assembly (component spacing ≤0.3mm for 0201).
• Intelligent Operation: Embedded vision camera for real-time component pose detection and dynamic path optimization, reducing air travel by 20%. Supports automatic nozzle change (24-station standard/40-station optional) with RFID tracking for maintenance traceability.

Defect Prevention

• Side-View Inspection: Detects chip component misalignment (skew, tombstoning) with ≥99.9% accuracy to prevent defective placement.
• Optional Coplanarity Gauge: Verifies lead flatness for tray-mounted components (e.g., QFP) to avoid solder joint defects.

Feeder System

High-Density Feeding Solution

• Reel Feeding Capacity: Supports 96 stations (8mm tape equivalent), compatible with 8–56mm pneumatic feeders (F1/F2) and 8–88mm electric feeders (F3) for continuous material flow.
• Tray Feeding Module (sATS15R): Handles 15 types of JEDEC-standard trays, enabling unattended component supply and reducing manual intervention.
• Modular Feeder Design: Ultra-thin lightweight feeders with AutoLoading technology cut changeover time by 30%; supports mixed legacy/new trolleys (CFB-45E/CFB-36E) for flexible production setups.

PCB Processing System

Versatile Substrate Handling

• Size Compatibility: Standard 50×50–510×460mm; expandable to 950×460mm for industrial PCBs (LED, automotive).
• High-Velocity Conveyor: 900mm/sec transport speed with laser-guided dynamic width adjustment, eliminating mechanical stops for routed/odd-shaped boards.
• Front-Locating Clamping: ±0.1mm positioning accuracy via front reference + vacuum clamping, ensuring stability during high-speed placement.

Vision & Inspection System

Advanced Quality Control

• In-Head Vision Module: 5MP camera enables high-speed inspection (≤0.1s/component) for ≤12×12mm components (e.g., BGA), reducing head travel distance.
• Dual-Sensor Pick Verification: Combines negative pressure sensing and visual confirmation to detect mispicks/over-picks with ≥99.9% reliability.
• Preventive Maintenance: Automatic nozzle cleaning station and RFID-based wear tracking maintain suction stability and prevent placement drift.

Motion Control System

High-Precision Actuation

• AC Servo Drives with Linear Guides: Achieves ±35μm positioning accuracy and ±15μm repeatability, suitable for ≤0.4mm pitch components.
• AI-Driven Trajectory Optimization: Reduces idle time by 15% through component distribution analysis, enhancing single-board productivity.

Core Systems & Integration

Intelligent Software Suite

• Automated Program Generation: CAD-to-Gerber conversion shortens new product introduction (NPI) time by 50%; multi-language HMI (EN/JP/KR/CN) simplifies operation.
• Smart Factory Ecosystem: Real-time data upload (placement coordinates, nozzle status) via Yamaha’s MES-compatible platform, enabling automotive-grade traceability.

Compact Hardware Design

• Space-Saving Footprint: 1,254×1,440×1,445mm dimensions with 1,230kg mass fits dense production lines.
• Tool-Less Maintenance: One-touch nozzle bracket replacement and batch cleaning reduce MTBM (mean time between maintenance) by 40%.