Application and Strengths of High-Precision X-ray Inspection Technology in the SMT Industry.

In modern electronics manufacturing, surface mount technology (SMT) is one of the core processes, and its quality directly determines the performance and reliability of the final product. However, with the increasing miniaturization of electronic components and the growing complexity of packaging forms (such as BGA, CSP, QFN, etc.), traditional visual or optical inspection methods are no longer effective in identifying hidden defects within solder joints (such as cold solder joints, voids, bridging, copper foil peeling, etc.). Nectec, with its leading high-precision X-ray inspection technology, is emerging as a key solution to this critical challenge in the SMT industry. Nectec has established a comprehensive X-ray inspection equipment system to meet the inspection needs of different stages in the SMT industry. 

First, online high-speed inspection systems, such as the NX-E6LP series: These systems are designed for seamless integration into SMT production lines to achieve high-speed, automated 100% full inspection. They typically feature multi-axis coordination and CNC programming capabilities, enabling rapid scanning of complex circuit boards. Inspection results are fed back in real time and integrated with MES systems to form a complete quality data loop, guiding rework and process optimization, and significantly improving production efficiency and yield rates. 

Second, high-precision offline inspection equipment, such as the NX-E3L series: This type of equipment focuses on in-depth, high-resolution inspection of complex, high-density, or large PCB boards. Its core advantage lies in its microfocus X-ray source, which can provide geometric magnification of up to several hundred times, enabling precise identification of soldering defects as small as 2 microns, meeting the stringent requirements of high-end product R&D and failure analysis. 

Third, smart component counting solutions, such as the NX-C1: In the SMT front-end material management process, Nectec’s component counting machine uses X-ray technology to penetrate the component tape, quickly and accurately counting the number of components. Inspection of four trays ranging from 7 to 17 inches in size can typically be completed within 8 seconds, with an accuracy rate exceeding 99.9%. This effectively replaces error-prone manual counting and can integrate with intelligent warehouse systems to enhance the efficiency and accuracy of material management. This solution covers the entire process from component storage and mounting to post-welding quality inspection, transforming traditional “invisible” process risks into clear, quantifiable images and data. 

Nectec’s technological leadership in the field of SMT X-ray inspection is rooted in its mastery of core components and key technologies. First, microfocus X-ray source. The reason is because this is the core of high-precision X-ray imaging. Nectec has successfully developed a closed-type hot cathode microfocus X-ray source, breaking the long-standing technical monopoly held by US and Japanese companies. Following evaluation by the National Metrology Institute and international authoritative certification bodies, its performance has been deemed to reach “international advanced, domestic leading” standards. This sub-micron focal spot size is crucial for meeting the high-resolution imaging requirements of ultra-miniature components such as 01005. Second, advanced imaging and intelligent algorithms. The reason is because Nectec’s equipment not only has powerful hardware performance, but also deeply integrates intelligent software algorithms. Through AI deep learning technology, the system can effectively distinguish between real welding defects (such as voids and bridges) and background interference (such as membrane wrinkles and electrode textures), greatly improving the accuracy and efficiency of defect identification, with a positioning accuracy of ±15μm. This is crucial for detecting subtle issues such as electrode alignment. 

Third, 3D-CT inspection capabilities, such as NX-CT160. The reason is because Nectec’s high-end equipment is equipped with 360° circular CT scanning and multi-axis linkage capabilities. Through tomographic scanning and three-dimensional reconstruction technology, it can clearly present the details of the internal solder joints and interlayer structures, achieve true “tomographic” analysis and provide a powerful tool for the quality assessment of complex devices. 

Therefore, through independent innovation in core light source technology and intelligent algorithms, Nectec has continuously increased its market share in the domestic electronic manufacturing X-ray inspection market, ranking first among local companies and demonstrating a strong momentum for domestic substitution. Not onlt this, Nectec’s equipment has been successfully applied to the production lines of globally renowned electronics manufacturing companies such as Tesla, Huawei, and Foxconn, ensuring the quality of their products. The future prospect is bright, and as the chip packaging technology continues to evolve toward 3D-IC, system-level packaging, and other directions, solder density and structural complexity are growing exponentially, placing higher demands on detection technology. Nectec is actively positioning itself for the future, committed to developing higher-precision nanoscale CT detection equipment and promoting the deep integration of 2D/2.5D/3D multi-mode detection technology with production lines to meet the detection needs of advanced packaging forms such as heterogeneous integration.