Srpen 14 2025
Technologie
How Nectec's pick and place machines is leading the future of SMT technology advancement.
The company launched its first-generation SMT placement machine in 2008, at which time all core technical components were imported. However, after more...
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Srpen 14 2025
Technologie
Core Applications and Technological Evolution of Nectec's SCADA Systems in SMT Chip Interconnection.
We will be discussing the core functions and architecture of SCADA Systems. SCADA (Supervisory Control and Data Acquisition) is a key infrastructure...
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Srpen 13 2025
Technologie
Analysis of Core Technologies in SMT Electronic Component Assembly.
First, we would like to discuss about the core Analysis of SMT surface mount technology. SMT (Surface Mount Technology) is a core...
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Srpen 13 2025
Technologie
How Nectec's NT-L12 shows up on the big stage for its compatibility and versatility to the sizes of PCB board
Taking Nectec's self-developed SMT pick and place machine NT-L12 as an example, this model adopts high-speed universal integrated technology, achieving a qualitative...
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Srpen 13 2025
Technologie
Analysis and Key Points of SMT Chip Mounting Technology
Surface Mount Technology (SMT) assembly is a core process in modern electronic manufacturing, enabling efficient and precise connection between components and printed...
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Srpen 13 2025
Technologie
SMT chip mounting technology: driving the miniaturization of semiconductor development boards
In the explosive growth of portable electronic devices, the Internet of Things terminal form continues to evolve, semiconductor development board as the...
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Červenec 17 2025
Technologie
Montáž čipů SMT a polovodiče: jak stroje Nectec pick and place hrají roli v revoluci výkonnosti vývojových desek prostřednictvím technologické symbiózy
In the process of semiconductor technology continues to break through the physical limit, SMT (surface mount technology) as the core process of...
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Červenec 17 2025
Technologie
Detailed steps for soldering surface mount components on PCBs and the specifications of Nectec's pick and place machines
Jak se elektrické součástky menší než zrnko rýže na základní desce mobilního telefonu "přilepí" na desku plošných spojů a vedou elektřinu?...
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